Evaluación de Nuevas Tecnologías PPT (Giammatteo
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Evaluación de Nuevas Tecnologías PPT (Giammatteo
Nuevas Tecnologías Si bien hay muchos fabricantes , tan solo 2 marcas en el mercado son las más conocidas y se alzan como competidoras muy serias. Hace algunos años Intel estaba a la cabeza tanto de fabricación como de ventas y distribución, pero un cambio en el mercado con una fuerte aparición de AMD ha establecido un nuevo estándar en las configuraciones de los equipos de venta directa. Porqué retrasar el reemplazo de PCs no es una buena decisión tecnológica ni financiera? “El consejo que continuamente les doy a mis colegas de IT es que demuestren el valor que trae al negocio cualquier gasto en tecnología. Habiendo sido CIO, siempre he creído que los gastos en tecnología deben verse como un activo para la compañía, y no como un costo para mantener operando el negocio” Stacy Smith, Intel CFO El dilema actual • Derivado de la crisis económica mundial muchas organizaciones están retrazando el reemplazo de equipo de cómputo para reducir sus costos • Pareciera una decisión correcta (menos dinero que gastar), sin embargo. . . – Qué hay del costo asociado de mantener equipo viejo ? (mayor a 3 años) – Qué hay del mayor consumo de energía asociado a equipos viejos ? – Qué hay de los mayores riesgos de seguridad ? – Qué hay del costo por m² que ocupan los servidores viejos ? Porqué los equipos a partir de 3 años cuestan más? • En promedio el costo de mantenimiento de un equipo después del 3er año se incrementa en un 59% (*) Impresoras (6%) Equipo LAN (7%) • Un equipo de 3 años o más consume 80% más energía eléctrica (*) – Los datacenters acaparan la atención debido a la concentración de equipos, sin embargo las PC‟s y sus periféricos consumen mucha más energía Equipo Telecoms móviles (9%) Equipo Telecoms Fijas (15%) PCs & Monitores (39%) Servidores incluyendo enfriamiento (23%) • Equipos de 4 años de antigüedad pueden experimentar un 53% de incremento en incidentes de seguridad (*) (*) “Using Total Cost of Ownership to Determine Optimal PC Refresh Lifecycles”, Wipro Technologies, March 2009 (www.wipro.com/industryresearch). Fuente: Gartner Inc. “Tera-Architectures A Convergence of New Technologies” by Martin Reynolds July26, 2007 Intel sugiere considerar los siguientes aspectos al evaluar una renovación de equipo de cómputo • Productividad de los empleados • Costos energía eléctrica & eficiencia energética • Costos operativos (administración y soporte) • Costos asociados a problemas de seguridad informática • Costos asociados al paro de labores originado por desastres naturales o problemas de salud pública 6 Intel® vPro™ La tecnología Intel® vPro™ ayuda a reducir los costos de mantenimiento de PCs mediante • Desempeño inigualable • Menor consumo de energía • Diagnóstico y reparación remota • Administración de Activos fuera de línea • Aislamiento y recuperación de PCs/Laptops infectadas E8500 Multitarea con aplicaciones de productividad1 Hojas de cálculo complejas + virus scan2 Consumo de energía promedio4 (mayor es mejor) (menor es mejor) (menor es mejor) 3.6x más rápido 6.7x más rápido 1.5x mejor 55 segundos 66.0 watts 6min. 13 seg. 100.9 watts 202 P4 630 (WinMark) 54.8 (WinMark) Intel® vPro™ La tecnología Intel® vPro™ ayuda a reducir los costos de mantenimiento de PCs mediante • Toda la funcionalidad de una PC más los beneficios de la movilidad • Mismas capacidades de administración de activos • Diagnóstico y reparación remota • Administración de Activos fuera de línea • Aislamiento y recuperación de PCs/Laptops infectadas • Menor consumo de energía P8600 T2700 Hojas de cálculo complejas + virus scan2 Word + PowerPoint + virus scan2 Consumo de energía promedio4 (menor es mejor) (menor es mejor) (menor es mejor) 1.2x más rápido 1.3x más rápido 1.6x mejor 1hr + duración de batería 1 min. 45 seg 1 min. 50 seg 20.3 watts 2 min. 8 seg 2 min. 24 seg. 33.0 watts Intel® Xeon® Comparado con servidores de hace 4 años • Hasta 9 veces mayor desempeño por servidor • Con un 18% de reducción en consumo de energía • Capacidad de consolidación 9 a 1 • Hasta 90% menor costo de operación • 89% reducción de espacio físico • 92% reducción consumo de energía (anual) • Retorno de inversión estimado de 8 meses En 2005. . . HOY 9:1 184 servidores Xeon® de 1 núcleo 21 servidores Xeon® 5500 de 4 núcleos 90% en reducción de costos de energía Arquitecturas Intel® de Servidor para la Empresa Intel proporciona elección de arquitectura y flexibilidad en la evolución a los 64 bits Arquitectura actual Beneficios Rendimiento proporciona líder, libre deelección 64 de bits ej. Database, ERP, BI,soluciones HPC OS y desde el centro de fabricante datos hasta el puesto cliente Arquitectura elegida Intel Arquitectura RISC arquitectura IA-32 Memoria Extendida cuando se necesite. Gran rendimiento en 32 bits Rendimiento, robustez y escalabilidad líderes. Arquitectura 64bits pura Precio/prestaciones líderes con posibilidad de direccionamiento 64 bits * Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of Intel products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. Arquitectura Intel® Itanium 2 ¿Por qué Itanium?: Más que un procesador de 64 bits EPIC=Proceso de instrucciones explícitamente paralelo EPIC 2 años Rendimiento SuperScalar + 9 años RISC CISC + 20 años 10-15 años Nueva arquitectura Paralelismo explícito Predicación Especulación Recursos masivos Compatibilidad IA-32 Y por supuesto, direccionamiento de 64 bits Tiempo La arquitectura para los próximos 25 años Arquitecturas Tradicionales: Paralelismo Limitado Código fuente original Código máquina secuencial Hardware Código paralelizado Compilación Multiples unidades functionales Unidades de ejecución disponibles usadas ineficientemente .. . .. . .. . Los procesadores actuales están con frecuencia hasta un 60% desocupados .. . Arquitectura de Microprocesador Itanium™: Paralelismo Explicito Código fuente original Código máquina Ya paralelizado Compilación Compilador Múltiples unidades funcionales Hardware Un compilador optimizado para Itanium™ analiza el código en su totalidad al compilar Uso más eficiente de los recursos de ejecución .. . .. . .. . .. . Optimiza la ejecución en paralelo Procesador Intel® Itanium® 2 9M Procesadores MP, máximo rendimiento, 130W • Itanium® 2 Processor 1.60GHz, 9MB • Itanium® 2 Processor 1.6GHz, 6M • Itanium® 2 processor 1.5GHz, 4M Procesadores DP, líderes en $/FLOP, solo DP • Itanium® 2 Processor 1.60GHz, 3MB, 400MHz FSB, 99W • Itanium® 2 Processor 1.6GHz, 3M, 533MHz FSB, 99W Procesador de bajo consumo • Itanium® 2 processor 1.3GHz, 3M, 62W Mayor rendimiento, compatibilidad hardware Roadmap de procesadores Intel® Itanium Plataformas Multi-procesador (MP) Plataformas Intel® Itanium® 2 MP Common Platform Arch. Tukwila Montecito/Montvale (Madison 9M) Plataformas de dos procesadores (DP) Plataformas Intel® Itanium® 2 DP e Itanium 2 LV (Fanwood) Arquitectura EPIC MCA mejorado Power Mgmt IPMI 2.0 • • • • • • • Dual-core Multi-threading Tecnologías Foxton, Pellston Power Mgmt (Pconfig /PSMI) Tecnologías Silvervale Fully Buffered DIMMs Gestionabilidad: Redirección de consola (KVM, IDE-R), Futuros chipset • • • • • Multi-core Virtualizacion mejorada Mejoras en I/O & memoria Mejoras RAS Common platform architecture • Gestionabilidad : Auto Provision, Auto Protección + + Plataformas actuales Futuras Plataformas Millington (+ LV)/ DP Montvale (+ LV) 2005-2006+ Futuro Dual core y después: Multi-Core Hoy Single Core 2005-2006 Dual Core Futuro Multi-Core 4 o más cores Cache Core Cache Core Cache Core + Cache • Futuras tecnologías de fabricación de Intel (90nm, 65nm) permitirán multiples cores manteniendo el tamaño de “die” y el consumo dentro de los límites actuales Dual Core es sólo el principio… All products, dates and features are preliminary and subject to change without notice Procesadores Intel Xeon e Intel Xeon MP ¿Qué es Intel® EM64T? Funcionalidades Modos Direccionamiento de memoria extendido Legacy Mode 32 OS / 32 Apps 64-bit Pointers, 64-bit Registers + Registros Adicionales 8-SSE & 8-Gen Purpose Calculo Enteros de Doble Precision (64-bit) Soporte de Espacio de direcciones plano + Compatibility Mode 64 OS / 32 Apps 64-bit Mode 64-bit 64/64 64 OS / 64 Apps = Con Intel® EM64T Evolucion de la arquitectura IA-32 con mejoras para soportar extensiones de memoria a partir de mediados de 2004 EM64T Modos soportados EM64T Modo Legacy Modo Compatibilidad Modo 64-Bit • SO 32-bit OS • SO 64-bit • SO 64-bit • Aplicaciones 32bit • Aplicaciones 32-bit • Aplicaciones 64-bit • Drivers 64-bit • Drivers 64-bit • Espacio de direccionamiento 4 GB • Espacio virtual de direcciones plano de 64-bit • Drivers 32-bit • Registros (GPR) 32-bit • Registros (GPR) 64-bit Procesador Intel® Xeon™: La nueva generación de plataformas empresariales hasta 2 procesadores Procesador Intel® Xeon™ a 3.60 GHz con FSB 800 MHz y 2 MB de Anunciado el 14 caché de nivel 2 de Febrero Intel® E7525 Chipset Chipset Intel® E7520 Chipset Intel® E7320 Procesador Intel® IOP332 I/O Arquitecturas Optimizadas para Servidor y Workstation Procesador Intel® Xeon™ MP: 2 nuevas plataformas multiprocesadoras • Plataforma MP de Rendimiento – Procesador Intel® Xeon™ MP 64-bit • 3.33 GHz / 8MB L3 cache • 3.00 GHz / 8MB L3 cache • 2.83 GHz / 4MB L3 cache – Chipset Intel® E8500 • Plataforma MP de Valor – Procesador Intel® Xeon™ MP 64-bit • 3.66 GHz / 1MB L2 cache • 3.16 GHz / 1MB L2 cache – Intel® E8500 Chipset Anunciados el 29 de Marzo Nueva plataformas Intel® Xeon™ RAS Reliability Availability Serviceability bus con corrección errores ECC, mirroring & RAID de memoria (solo MP) Consumo de Potencia New New Demand Based Switching XD bit New RAID Inteligente New Nueva Generación de BUS E/S: PCI Express Memoria más rápida: DDR2 New New nuevos chipsets avanzados Extensiones 64-bit Bus de Sistema más rápido: 800MHz (DP) y doble bus a 667MHZ (MP) New Mejoras en la Arquitectura: SSE3, HT optimizado Capacidad de crecimiento Procesador Xeon a 3.6GHz y 2 MB L2 cache Procesador Xeon MP a 3.33GHz y 8 MB L3 cache Rendimiento Mirando hacia el futuro • Nuevas Tecnologías que permitan el crecimiento futuro de su negocio – – – – – Soporte 64-Bit Multi-Core Tecnología de Virtualizacion Intel® Tecnología Intel® de Aceleración de E/S Tecnología Intel® Active Management Núcleos múltiples : Rendimiento a través del Paralelismo Rendimiento Normalizado vs. el primer procesador Intel® Pentium® 4 Performance MULTI-CORE 10X Estamos aquí SINGLE CORE 3X 2004 2000 Previsión de futuro Source: Intel 2008+ Resumen • Una sola plataforma de servidor no responde a todas las necesidades de la informática empresarial actual • La gama de procesadores para servidores de Intel es la más completa y se adapta a cada tipo de necesidad • La migración progresiva a los entornos de 64 bits permitirá a los usuarios de bases de datos eliminar cuellos de botella y obtener mayor rendimiento • Futuras tecnologías como los núcleos múltiples o la tecnología de Virtualización acentuarán aún más el liderazgo de los procesadores Intel para servidores Recursos de referencia Estimador para Renovación de PCs • Estimador de TCO www.intel.com/business/business-pc/roi/demo.htm Estimador para Renovación de Servidores • Estimador de TCO www.intel.com/go/xeonestimator Porqué Renovar con Tecnología Intel® vPro™ • Estimador de ROI en línea para calcular los ahorros con vPro™ www.intel.com/business/business-pc/roi/demo.htm AMD Habla De Su Primera Arquitectura Completamente Nueva • Nuestro equipo editorial, ha llevado a cabo una excelente labor para informales todo lo último que ha "comentado" AMD durante el AMD Analyst Day en relación a su futuro en el sector de los procesadores. Así, ya les hemos contado sobre sus futuras plataformas deEscritorio, Móviles y Servidores, les hemos hablado del Sandtiger Octa-Core, de la tecnología G3 Memory Extender, los procesos de fabricación, y por supuesto del ya conocido Barcelona. Sin embargo, esto no es todo, y a continuación queremos introducirlos en algunos nuevos conceptos, fundamentales para AMD, que son la base de todo lo recién indicado y que permitirá complementar la excelente cobertura ya entregada y mencionada en las líneas superiores. 1.- M-Space. • Tal como se indicó, AMD planea lanzar su plataforma Opteron de tercera generación, el año 2009, con el procesador Sandtiger OctaCore. Bajo este procesador, se encuentra un nuevo acercamiento de la Compañía, modular, denominado M-Space. De acuerdo a la gente de AMD, M-Space permite mezclar y calzar funciones de una CPU para determinadas tareas. "Acercamiento modular de M_Space" Definición de M-SPACE • La definición de M-Space, es la siguiente, – a.- Modular: "Bloques de diseño" reconfigurables para mayor agilidad y velocidad. – b.- Escalable: Escalamiento linear de rendimiento "multi-thread" y "single-thread“. – c.- Portabilidad: Eficiencia energética para mayor portabilidad y movilidad. – d.- Accesibilidad: Compromiso a una innovación abierta. – e.- Compatible: Compatibilidad hacia atrás y facilidad de actualización. – f.- Eficiencia: Eficiencia óptima en el chip y a nivel de Entrada/Salida. "Definición del concepto M-Space" • Como se puede apreciar, M-Space es una completa redefinición de la estrategia de diseño de AMD, la cual, como se mencionó, es la base del Sandtiger. • Pese a lo anterior, este nuevo procesador también incluye otro concepto, no menos interesante, eje central de los planes futuros de la Compañía, el cual pasamos a revisar a continuación. 2.- Bulldozer. • El Sandtiger de 8 núcleos de AMD, consiste en 8 Bulldozers. Suena extraño el nombre, el cual ha sido asociado a una intención, por parte de la Compañía, de demoler el mercado con este producto. • Bulldozer, es el nombre que la Empresa le ha dado a uno de los núcleos de CPU que se basan en la ya mencionada arquitectura M-Space. AMD ha indicado que se obtendrán mejoras dramáticas en rendimiento por watt, en aplicaciones de Computación de Alto Rendimiento ("High Performance Computing" o "HPC"), al usar los núcleos Bulldozer. "Objetivo del nuevo núcleo Bulldozer" • Lo interesante del tema, es que a diferencia de Barcelona y Shangai, los cuales corresponden a una evolución de la longeva arquitectura K8, Bulldozer es algo totalmente nuevo y diferente. • AMD colocará 8 núcleos Bulldozer en el Sandtiger, con un controlador de memoria. Segúnla Compañía, el concepto detrás de M-Space podrá verse en este producto al optimizarse el diseño para Servidores y elevar la vara del rendimiento por watt, tanto para aplicaciones "single-threaded" como para aquellas "multi-threaded". Algunos expertos ya hablan de plataformas capaces de "mutar" de acuerdo a los requerimientos de las aplicaciones. 3.- Fusion. • La arquitectura M-Space, también puede relacionarse con la comentada tecnologíaFusion, la cual mezcla CPUs y GPUs. • AMD planea mezclar y calzar componentes del concepto M-Space en Falcon, un procesador Fusion optimizado para Computadores de Escritorio mainstream, y paraPortátiles. Falcon es la base de la plataforma de rango medio de Escritorio de AMD, llamada Copperhead. "Componentes del Falcon-Fusion" • Falcon cuenta con cuatro núcleos Bulldozer, junto a un procesador gráfico integrado. Esta GPU, soporta tecnología DirectX 10, posiblemente DX11, y cuenta con la tecnología de AMD denominada Universal Video Decoder o UVD. También posee un PCIe integrado. 4.- Bobcat. • Junto con Bulldozer, AMD cuenta con el núcleo Bobcat, también para procesadoresFusion, diseñado para aplicaciones moviles, ultra-móviles y de electrónica de consumo.Bobcat también es un diseño completamente nuevo y cuenta con grandes capacidades de escalamiento energético. Los procesadores basados en Bobcat pueden llegar a consumir sólo 1 watt de energía. No se conocen mayores detalles de los procesadoresFusion con "tecnología Bobcat". "El Bobcat dirigido al sector móvil" 5.- GPUs. • Cuando AMD compró ATI, obviamente era con una idea fija en mente. En efecto, la Compañía está plenamente convencida que el desarrollo gráfico, y por supuesto la ya tan comentada integración con CPUs, es más importante que dedicarse sólo al diseño deprocesadores. Obviamente, ambos conceptos están fuertemente arraigados e interrelacionados en los Roadmaps de la Compañía. "Nuevas tecnologías gráficas de AMD-ATI, primera parte" • Después del desastre que se ha obtenido con la incursión de AMD en el mundo DirectX 10, muchos pueden mirar con cierta mofa a la Compañía, cuando ésta se refiere a gráficos de la siguiente generación. "Nuevas tecnologías gráficas de AMD-ATI, segunda parte" • Para el común de las personas, ATI es sinónimo de tarjetas de video para jugar. Sin embargo, no debe olvidarse que ésta, siempre ha sido un fuerte suministrador de productos para dispositivos móviles, y AMD intenta continuar en esa línea, fortaleciéndola, al integrar tecnologías que se observan en los PCs, a los más variados dispositivosportátiles. 6.- Palabras Finales. • Tiempo atrás, AMD fue muy criticada por guardar silencio en relación a sus nuevos proyectos y tecnologías. Incluso, se llegó a decir que eso había influido en los últimos "fracasos" de la Compañía. En esa oportunidad, AMD se comprometió a ser "más abierta". • Claramente, la Empresa ha cumplido con lo prometido, pero se ha ido al otro extremo. Nos ha llenado de anuncios, conceptos, nombres, etc. Todo bien, claro que esto debe plasmarse en lanzamientos reales ya que muchos simplemente, cuando miran hacia AMD, piensan, • "…ver para creer.“ • Ciertamente, Bulldozer, sin desmerecer las otras tecnologías, será el "caballo de batalla" de AMD. Es un alejamiento definitivo de la fiel plataforma K8, pero al mismo tiempo es un tremendo desafío. "Visión modular del futuro por parte de AMD" SUN Microsystems Scalable Processor Architecture (SPARC) Overview •Designed to optimize compilers and pipelined hardware implementations. • Offers fast execution rates. • Engineered at Sun Microsystems in 1985 Based on RISC I & II which were developed at University of Cal at Berkeley. • SPARC “register window” architecture Features Performance and Economy Simplified instruction set Higher number of instructions with fewer transistors Scalability Flexible integration of cache, memory and FPUs Open Architecture Compatible technology to multiple vendors Now allow access to CPU component techniques Complete set of development tool available for h/w & s/w Registers General purpose/ working data registers IU‟s „r‟ registers FPU‟s „f‟ registers Control status registers IU control/status registers FPU control/status registers Coprocessor (CP) control/status registers Registers Window Overlapping Each window shares its ins and outs with two adjacent windows Incremented by a RESTORE instruction decremented by a SAVE instruction Due to windowing the number available to software is 1 less than number implemented When a register is full the outs of the newest window are the ins of the oldest, which still contain valid program data IU Control/Status Registers Processor State Register (PSR) Window Invalid Mask (WIM) Multiply/Divide (Y) Program Counters (PC, nPC) Ancillary State Registers (ASR) Deferred-Trap Queue Trap Base Register (TBR) IU Control/Status Registers Processor State Register (PSR) Contains various fields that control and hold status information Impl 31:28 Ver 27:24 Icc 23:20 Reserved 19:14 EC 13 EF 12 PIL 11:8 S 7 PS ET 6 5 CWP Window Invalid Mask (WIM) To determine a window overflow or underflow W31 W30 W29 ----------------------- W1 W0 4:0 Memory Each location identified by Address Space Identifier (ASI) 64-bit address Real memory No side effects I/O locations Side effects Snoop Instruction Formats VIS – Visual Instruction Set Visualization built into chip Examples of formats Processor Comparison Summary Architecture Open versus proprietary 64-bit architecture High volume processor High bandwidth UltraSPARC-IIi SPARC V-9 Open Ð Ð Ð HP PA-8000 HP-PA Proprietary Integration Level On-chip MMU On-chip I/O interface On-chip cache On-chip multimedia support Ð Ð Ð Ð Ð 300 MHz Features Clock speed Binary compatibility with existing applications Performance SPECint95/fp95 Target Environment Cyrix MediaGX X86 Proprietary Ð Ð MIPS R10000 MIPS III Open Ð Intel Pentium II PowerPC 603e X86 PowerPC Proprietary Open Ð Ð Ð Ð Ð Ð Ð Ð Ð 180 MHz 180 Mhz Ð Ð >12/>12 11.8/18.7 Low cost desktops and servers Workstations Low-power, and low-cost servers desktops and Ð Ð Ð Ð 195 MHz 233-300 Mhz 300 MHz Ð Ð Ð Ð N/A 10.7/19.0 11.7/8.15 7.4/6.1 High-end embedded applications: networking, Desktops Workstations Workstations and portables servers What makes the CISC lock-up? Elegant forward looking branch instruction set Compiler can go to different branches More complete testing of SPARC Simpler compiler design Better integration of OS interrupts to H/W interrupts Solaris has a tighter source code Less devices to support References Weaver, David/Tom Germond. SPARC Architecture Manual: Version 9, Prentice Hall. 1994. Stallings, William. Computer Organization and Architecture: 5th Edition, Prentice Hall. 2000. Bresani, Fred. Systems Engineer, Sun Microsystems. http://www.sun.com http://www.sparc.com http://www.fujitsu.com IBM POWER 7 Series May 2010 •POWER7 Processor Agenda •POWER7 Servers POWER 750 POWER 755 POWER 770 POWER 780 POWER Blades •Performance/Competition •Active Memory Expansion •Related Announcements •Upgrades •Q&A Customers are Moving to Higher Value …as shown by the largest shift of customer spending in UNIX History UNIX Server Rolling Four Quarter Average Revenue Share POWER6 POWER5™ Micro-Partitioning Live Partition Mobility POWER4™ Dynamic LPARs Source: IDC Quarterly Server Tracker Q309 release, November 2009 POWER7 System Highlights •Balance System Design – Cache, Memory, and IO •POWER7 Processor Technology – 6th Implementation of multi-core design – On chip L2 & L3 caches •POWER7 System Architecture – Blades to High End offerings – Enhances memory implementation – PCIe, SAS / SATA •Built in Virtualization – Memory Expansion – VM Control •Green Technologies – Processor Nap & Sleep Mode – Memory Power Down support – Aggressive Power Save / Capping Modes 600 500 400 300 •Availability – Processor Instruction Retry – Alternate Process Recovery – Concurrent Add & Services 200 100 0 JS23 JS43 520 550 560 570/16 570/32 595 73 Power your Planet + AIX - the future of UNIX Total integration with i Scalable Linux ready for x86 consolidation Workload-Optimizing Systems Virtualization without Limits Drive over 90% utilization Dynamic Energy Optimization 70-90% energy cost reduction Dynamically scale per demand EnergyScale™ technologies Resiliency without Downtime Roadmap to continuous Management with Automation VMControl to manage availability High availability systems & scaling virtualization Automation to reduce task time Smarter Systems for a Smarter Planet. POWER7 Processor POWER7 Processor IBM POWER Processor Roadmap 3 Year Revolution 18 month “+” evolution POWER8 POWER7/7+ POWER6/6+ POWER5/5+ POWER4/4+ Hardware Virtualization First Dual Core for Unix & Linux Dual Core & Quad Core Md in Industry Enhanced Scaling Dual Core Chip Multi Processing Distributed Switch Shared L2 Dynamic LPARs (32) 180nm, 2001 2 Thread SMT Distributed Switch + Core Parallelism + FP Performance + Memory bandwidth + 130nm, 90nm 2004 Fastest Processor In Industry Dual Core High Frequencies Virtualization + Memory Subsystem + Altivec Instruction Retry Dyn Energy Mgmt 2 Thread SMT + Protection Keys 65nm 2007 Most POWERful & Scalable Processor in Industry IBM is the leader in Processor and Server design 4,6,8 Core 32MB On-Chip eDRAM Power Optimized Cores Mem Subsystem ++ 4 Thread SMT++ Reliability + VSM & VSX Protection Keys+ 45nm, 32nm 2010 Future Cores: Transition from POWER6 POWER7 8 Intelligent Cores / chip (socket) 4 and 6 Intelligent Cores available on some models 12 execution units per core Out of order execution 4 Way SMT per core 32 threads per chip L1 – 32 KB I Cache / 32 KB D Cache per core L2 – 256 KB per core Chip: 32MB Intelligent L3 Cache on chip Memory: Dual DDR3 Controllers 100 GB/s sustained Memory bandwidth / chip Scalability: Up to 32 Sockets 360 GB/s peak SMP bandwidth / chip 590 GB/s peak I/O bandwidth / chip Up to 20,000 coherent operations in flight P Core Core O W L2 L2 E R G L3 Cache X eDRAM B U L2 S Core Core L2 L2 L2 L2 L2 Core Core Core Memory Interface Energy: Aggressive processor Nap & Sleep modes 10% “Over clock” when thermals are good Core Memory++ S M P F A B R I C Memory Channel Bandwidth Evolution POWER5 POWER6 POWER7 Memory Performance: 2x DIMM Memory Performance: 4x DIMM Memory Performance: 6x DIMM D D R 3 DDR2 @ 553 MHz Effective Bandwidth: 1.1 GB/s DDR2 @ 553 / 667 MHz Effective Bandwidth: 2.6 GB/sec D D R 3 D D R 3 D D R 3 D D R 3 D D R 3 D D R 3 D D R 3 D D R 3 DDR3 @ 1066 MHz Effective Bandwidth: 6.4 GB/sec D D R 3 Multi-Threading Evolution Single thread Out of Order S80 HW Multi-thread FX0 FX1 FP0 FP1 LS0 LS1 BR C XR L FX0 FX1 FP0 FP1 LS0 LS1 BR CR X L POWER5 2 Way SMT POWER7 4 Way SMT FX0 FX1 FP0 FP1 LS0 LS1 BR CR X L FX0 FX1 FP0 FP1 LS0 LS1 BR CR X L No Thread Executing Thread 0 Executing Thread 2 Executing 81 Thread 1 Executing Thread 3 Executing POWER7 TurboCore Mode Power 780 POWER7 TurboCore Chip Chip TurboCore Chips: 4 available cores Aggregation of L3 Caches of unused cores. TurboCore chips have a 2X the L3 Cache per Chip available –4 TurboCore Chips L3 = 32 MB Performance gain over POWER6. –Provides up to 1.5X per core to core Chips run at higher frequency: –Power reduction of unused cores. TurboCores With “Reboot”, System can be reconfigured to 8 core mode. Unused –ASM Menus Core P O W E R Core Core Core Core L2 G X B U S L2 L2 L2 32 MB L3 Cache L2 L2 L2 L2 Core Core Core Core Memory Interface S M P F A B R I C POWER7 Multi-Threading Options •TurboCore Option •50% of the available cores active Standard Option All cores active 3 3 2.5 2.5 2 2 1.5 1.5 1 1 0.5 0.5 0 0 SMT4 SMT2 Single SMT4 SMT2 Single POWER7 Servers Power Systems Portfolio Power 780 Consistency Binary compatibility Mainframe-inspired reliability Advanced Virtualization AIX, Linux and IBM i OS Complete flexibility for workload deployment Power 595 Power 770 Power 570 Power 750 Power 550 Power 700 701 & 702 JS Blades Power 520 Power 755 HPC Power 575 Power is the Innovation that will Deliver Business Advantages Leadership Performance and Energy Efficiency Industry leading performance with POWER7 processors Power 750 Express: 1- to 4-socket; 6- or 8-cores per socket ENERGY STAR-qualified Meets EPA guidelines for energy efficiency Workload-optimizing capabilities improve performance Power 750 Express Intelligent Threads optimization, Intelligent Cache sharing, Active Memory Expansion and 320 virtual machines in 2010 Intelligent Energy capabilities that balances performance and efficiency: Frequency boost for increased performance or reduction during low demand for energy reduction >3X increased performance per watt Ease of Ownership Popular, ready to run „Edition‟ configurations Light Path Diagnostics Customer Setup Power 750 System 8233-E8B POWER7 Architecture DDR3 Memory System Unit SAS SFF Bays 4U Depth: 28.8” System Unit IO Expansion Slots Integrated SAS / SATA System Unit Integrated Ports Integrated Virtual Ethernet System Unit Media Bays IO Drawers w/ PCI slots Cluster Redundant Power and Cooling Certification (SoD) EnergyScale 6 Cores @ 3.3 GHz 8 Cores @ 3. 0, 3.3, 3.55 GHz Max: 4 Sockets Up to 512 GB Up to 8 Drives (HDD or SSD) 73 / 146 / 300GB @ 15k (2.4 TB) (Opt: cache & RAID-5/6) PCIe x8: 3 Slots (2 shared) PCI-X DDR: 2 Slots 1 GX+ & Opt 1 GX++ 12X cards Yes 3 USB, 2 Serial, 2 HMC Quad 10/100/1000 Optional: Dual 10 Gb 1 Slim-line DVD & 1 Half Height PCIe = 4 Max: PCI-X = Max 8 12X SDR / DDR (IB technology) Yes (AC or DC Power) Single phase 240 VAC or -48 VDC NEBS / ETSI for harsh environments Active Thermal Power Management Dynamic Energy Save & Capping 750 CPW & rPerf Details 6-core 8-core 8-core 3.3 GHz CPW rPerf 6-core 37200 70.07 12-core 69200 134.54 18-core 94900 193.40 24-core 135300 252.26 8-core 44600 81.24 16-core 82600 155.99 24-core 122500 224.23 32-core 158300 292.47 8-core 47800 86.99 16-core 88700 167.01 24-core 129700 140.08 32-core 168800 313.15 181000 331.06 3.0 GHz 3.3 GHz #8335 #8334 #8332 8-core 3.55 GHz #8336 32-core POWER6 rPerf 550 (8) 4.7Ghz 68.20 550 (8) 5.0GHz 78.60 560 (16) 3.6GHz 100.3 0 570 (16) 4.4GHz 127.3 2 570 (16) 5.0GHz 141.2 1 595 (32) 4.2GHz 266.5 1 595 (64) 4.2GHz 479.8 9 595 (32) 5.0GHz 307.1 2 595 (64) 5.0GHz 553.0 1 Power 750 vs Power 550 / 560 Performance* / K BTU Performance* / KW 180 70 160 60 140 50 120 100 40 80 30 60 20 40 20 > 406% Improvement 0 10 > 421% Improvement 0 Power 750 Power 550 Power 560 Power 750 Power 550 Power 560 Power 755 4-Socket HPC System Power 755 4U x 28.8” depth Up to 8.4 TFlops per Rack ( 10 nodes per Rack ) 5.3 / 6.1 RHEL / SLES POWER7 Architecture 4 Processor Sockets = 32 Cores 8 Core @ 3.3 GHz DDR3 Memory 128 GB / 256 GB, 32 DIMM Slots System Unit SAS SFF Bays Up to 8 disk or SSD 73 / 146 / 300GB @ 15K (up to 2.4TB) System Unit Expansion Integrated Ports PCIe x8: 3 Slots (1 shared) PCI-X DDR: 2 Slots GX++ Bus 3 USB, 2 Serial, 2 HMC Integrated Ethernet Quad 1Gb Copper (Opt: Dual 10Gb Copper or Fiber) System Unit Media Bay 1 DVD-RAM ( No supported tape bay ) Cluster Up to 64 nodes Ethernet or IB-DDR Redundant Power Yes (AC or DC Power) Single phase 240vac or -48 VDC Certifications (SoD) NEBS / ETSI for harsh environments EnergyScale Active Thermal Power Management Dynamic Energy Save & Capping Power 755 vs. 750 Offering Structures Feature 750 755 Processors 32-core @ 3.3 GHz 8 / 16 / 24 / 32-core @ 3.55 GHz 6 / 12 / 18 / 24-core @ 3.3 GHz 8 / 16 / 24 / 32-core @ 3.0 GHz Memory 128GB - 256GB 4GB & 8GB DIMMS 8 - 512GB 4GB, 8GB, 16GB DIMMS GX slot support Yes – IB clustering Yes I/O Drawer support No Yes DASD Backplane No Split Backplane Split Backplane support Integrated Ethernet Quad GbE or Dual 10GbE Quad GbE or Dual 10GbE Virtualization No PowerVM support PowerVM Std and Ent System unit SFF Bays and drives 8 SFF SAS HDD / SDD 10k and 15K SFF drives 8 SFF SAS HDD / SDD 10k and 15K SFF drives Optional Integrated RAID Internal Tape No Yes Performance Metric TFLOPS rPerf Operating System AIX, Linux No H/W Raid Cards AIX, IBM i, Linux H/W Raid Cards 93 Power 770 Power 770 Processor Technology 4U x 32 inches Depth Maint. Coverage: 9 x 5 L3 Cache Redundant Power & Cooling Redundant Server Processor Redundant Clock Concurrent Add Support Concurrent Service System Unit Processors DDR3 Memory (Buffered) SAS/SSD SFF Bays DVD-RAM Media Bays SAS / SATA Controller PCIe bays GX++ Slots (12X DDR) Integrated Ethernet USB 12X I/O Drawers w/ PCI slots 6 Cores @ 3.55 GHz 8 Cores @ 3.1 GHz On Chip Yes Yes / Two Enclosure minimum Yes / Two Enclosure minimum Yes Yes Single Enclosure 4 Enclosures Up to 2 Sockets 8 Sockets Up to 512 GB Up to 2 TB 6 24 1 Slim-line 4 Slim-line 2/1 8/4 6 PCIe 24 PCIe 2 8 Std: Quad 1Gb Std: Four Quad 1Gb Opt: Dual 10Gb + Opt: Four x Dual 10Gb Dual 1 Gb + Dual 1 Gb 3 12 Max: 4 PCIe, 8 Max: 16 PCIe, 32 PCI-X PCI-X 94 Power 780 Power 780 Processor Technology 4 Cores @ 4.14 GHz 8 Cores @ 3.86 GHz On Chip TurboCore L3 Cache Redundant Power & Yes Cooling Redundant Server Yes / Two Enclosure minimum Processor Redundant Clock Yes / Two Enclosure minimum Concurrent Add Support Yes Concurrent Service Yes Single Enclosure 4 Enclosures System Unit Processors 2 Sockets 8 Sockets Maint Coverage 24 X 7 PowerCare Support DDR3 Memory (Buffered) SAS/SSD SFF Bays (CEC) DVD-RAM Media Bays SAS / SATA Controller PCIe (CEC) GX++ Slots (12X DDR) Integrated Ethernet USB 12X I/O Drawers w/ PCI slots Up to 512 GB Up to 2 TB 6 24 1 Slim-line 4 Slim-line 2/1 8/4 6 PCIe 24 PCIe 2 8 Std: Quad 1Gb Std: Four Quad 1Gb Opt: Dual 10Gb + Opt: Four x Dual 10Gb Dual 1 Gb + Dual 1 Gb 3 12 Max: 4 PCIe, 8 Max: 16 PCIe, 32 PCI-X PCI-X 95 770 and 780 CPW & rPerf Details 770 12-core 16-core 8-core 780 3.5 GHz CPW rPerf 12-core 73100 140.75 24-core 99000 261.19 36-core 131050 377.28 550 (8) 4.7Ghz 68.20 48-core 248550 493.37 550 (8) 5.0GHz 78.60 560 (16) 3.6GHz 100.30 570 (16) 4.4GHz 127.32 3.1 GHz #4980 #4981 POWER6 rPerf 16-core 88800 165.30 570 (16) 5.0GHz 141.21 32-core 155850 306.74 595 (32) 4.2GHz 266.51 48-core 229800 443.06 595 (64) 4.2GHz 479.89 64-core 292700 579.39 595 (32) 5.0GHz 307.12 CPW rPerf 595 (64) 5.0GHz 553.01 16-core 105200 195.45 32-core 177400 362.70 48-core 265200 523.89 64-core 343050 685.09 3.86 GHz #4982 780 TurboCore mode values not shown Power 770 & 780 vs Power 570 Differences Power 570 Power 770 & 780 Up to 8 sockets, Up to 32 Cores Up to 8 Sockets, Up to 64 cores Up to 768 GB Memory Up to 2 TB Memory ( Initial GA will be 1 TB) DDR2 DIMMS DDR3 DIMMS Six 3.5” SAS Bays / Enclosure Six SFF SAS Bays / Enclosure 4 PCIe & 2 PCI-X slots per Enclosure 6 PCIe slots per Enclosure No write cache or RAID-5/6 support Write cache & RAID-5/6 support Single integrated DASD / Media Cntlr Three integrated DASD / Media Controllers Optional Split Backplane No Power & Management Thermal Clock Cold Failover ECC with bit steer Concurrent Drawer Maint restrictions Concurrent Drawer Add cable restrictions Standard Split backplane Optional Tri-Split Backplane Power & Thermal management TPMD support Clock Hot Failover ECC with DRAM sparing No Restrictions ( 4Q / 2010 ) No Restrictions 97 IBM Power Systems Comparisons Nodes Cores (single system image) Frequency SMP buses System memory Memory per core Memory Bandwidth (peak) Power 750 Power 770 Power 780 Power 595 One 6, 12, 18, 24 or 8, 16, 24, 32 3.0, 3.3, 3.55 GHz 4 byte Up to 512 GB 16 or 21 GB Up to four Up to four 4 – 64 4 – 64 3.1, 3.5 GHz 8 byte Up to 2 TB* 32 or 42 GB 3.8, 4.1 GHz 8 byte Up to 2 TB* 32 or 64 GB Up to eight 8 – 64 Upgradeable to 256 4.2, 5.0 GHz 8 byte Up to 4 TB 64 GB 273 GB/s 1088 GB/s 1088 GB/s 1376 GB/s Memory Bandwidth per core (peak) Memory controllers 8.5 GB/s 17 or 22 GB/s 17 or 34 GB/s 21.5 GB/s 1 per processor 2 per processor 2 per processor 2 per processor I/O Bandwidth (peak) 30 GB/s 236 GB/s 236 GB/s 640 GB/s I/O Bandwidth per core (peak) I/O loops Total disk drives rPerf per core Maximum LPARs 0.9GB/s 3.6 or 4.9 GB/s 3.6 or 7.3 GB/s 10 GB/s Up to 2 Up to 576 Up to 11 Up to 320* RAS Standard Warranty PowerCare 9x5 No Up to 8 Up to 1200 Up to 11 Up to 640* Enhanced Memory Dynamic FSP & clocks 9x5 No Up to 8 Up to 1200 Up to 13 Up to 640* Enhanced Memory Dynamic FSP & clocks 24 x 7 Yes Up to 32 Up to 2640 Up to 10.8 Up to 254 Enhanced Memory Dynamic FSP & clocks 24 x 7 Yes * Planned availability in 4Q 2010 Standard Move Up to Enterprise Class RAS RAS Item Optional Not available Power 750 Power 770 Power 780 Redundant / Hot Swap Fans & Blowers Hot Swap DASD / Media / PCI Adapters Concurrent Firmware Update Redundant / Hot Swap Power Supplies Dual disk controllers (split backplane) Processor Instruction Retry Alternate Processor Recovery Storage Keys PowerVM™/Live Partition Mobility/Live Application Mobility Redundant Service Processors * * Redundant System Clocks * * Hot-node Add / Cold-node Repair * * Hot-node Repair / Hot-memory Add * * Dynamic Service Processor and System Clock Failover * * Hot-node Repair / Hot-memory Add for all nodes** * * Redundant / Hot Swap Power Regulators Dynamic Processor Sparing Memory Sparing Hot GX Adapter Add and Cold Repair POWER7 Enhanced Memory Hot GX Adapter Repair * Requires two or more nodes ** Planned for 4Q 2010 POWER7 systems are over twice as good as POWER6 systems! Twice the performance: Power 780 32-core performance per core is over twice the Power 570 32-core Twice the scaling: Twice the capacity: Power 770 and 780 both offer twice the number of cores as the largest Power 570 Power 770 and 780 offer more than twice (~3 times) the throughput of the largest Power 570 Twice the memory: - Over twice the physical memory of the Power 570 - Active Memory ExpansionTM enables up to twice the effective memory compared to what is physically installed Twice the energy efficiency: Power 770 & 780 offer over twice the performance per watt (up to 3 times) than the most efficient Power 570 Twice the cores for the same price: Buy twice the cores with the Power 770 and pay less than a comparable POWER6 based Power 570 POWER7 Blades Power System Blades PS700/701/702 4 Cores @ 3.0 GHz PS700 8 Cores @ 3.0GHz PS701 16 Cores @ 3.0GHz PS702 64GB/128GB/256GB PS700/PS701/PS702 POWER7 Architecture DDR3 Memory Internal Disk 0-2 SFF DASD PCIe Slots 2/2/4 Integrated SAS / SATA Yes System Unit Integrated Ports 3 USB, 2 Serial, 2 HMC Integrated Virtual Ethernet Quad Gigabit Optional: Dual 10 Gb EnergyScale Active Thermal Power Management Dynamic Energy Save & Capping Description rPerf CPW 8406-70Y PS700 4-cores 3.0GHz 45.13 21,000 8406-71Y PS701 8-cores 3.0GHz 81.24 42,000 8406-72Y PS702 16-cores 3.0GHz 154.36 76,300 IBM BladeCenter PS700/701/702 Express Smart BladeCenter Solutions with Power Blades • Performance and Energy Efficiency • Smart choices to minimize complexity, improve efficiency and scale easily • Single-wide 4 or 8-core or Double-wide 16-core • Elegantly simple scalability • Intelligent Threads • Utilizes more threads when workloads benefit • Intelligent energy optimization with EnergyScale Technology • Boosts frequency for more performance • High Performance Computing acceleration (AltiVec SIMD acceleration) • Execute up to eight single-precision or double-precision floating point operations per clock cycle per core • Flexibility and Choice • Supports AIX, i and Linux operating systems • Consolidate all three on a single platform • Supports multiple BladeCenter chassis . 105 4, 8 or 16 cores Single or Double Wide 3.0GHz POWER7 Up to 256GB of Memory Relative Performance New Power Blades are better than Sun CMT blades in every important performance category 5.00 4.00 3.00 2.00 1.00 0.00 Specjbb2005 Power 702 SPECint_rate2006 Sun T6340 Relative Performance Density • 2.4x to >3.0x better performance per blade, per core, and per socket • 2.2x to >3.9x better performance per rack unit • 1.6x to 3.0x better performance per Watt 4.00 3.00 2.00 1.00 0.00 Specjbb2005 Power 702 SPECint_rate2006 Sun T6340 Relative Energy Efficiency 3.00 2.50 2.00 1.50 1.00 0.50 0.00 Specjbb2005 Power 702 SPECint_rate2006 Sun T6340 Power Blades run faster and cost less than other UNIX blades Reinforces why Power Blades are the most popular blades for UNIX • Comparison to HP BL860c i2 – PS702 has > 3X performance 2 socket blade performance comparison POWER7 based blades vs Itanium 9300 based blades 600 500 400 – PS702 P/P is even better 300 200 100 0 SPECint_rate2006 SPECfp_rate2006 PS702 BL660c i2 Estimated HW Price/Performance for benchmark configurations Lower is better The Intel Itanium is tottering towards death, analyst reckons C Shanti | Thu 26th Nov 2009, 10:56 am http://www.tgdaily.com/hardware-features/44828-the-intelitanium-is-tottering-towards-death-analyst-reckons 300 200 A report from senior analyst Jon Peddie suggests that Intel's 64 bit flagship microprocessor, the Itanium, is dead in the water. So is it a turkey? 100 0 SPECint_rate2006 SPECfp_rate2006 PS702 BL660c i2 See substantiation chart for sources & benchmark detail IBM Power Blades Deliver Lower TCA than HP x86 blade solution At equal capacity for a full BladeCenter H Chassis with 7 two socket (16-core) PS702 blades compared to a full HP C7000 Blade Chassis with 16 two socket (12-core) HP BL460c G6 blades leveraging the higher utilization and virtualization efficiency capabilities of Power Blades. 39% lower TCA with 56% less blades HP Solution US$347,271 IBM Solution US$213,053 See Lower TCA chart for sources and substantiation BladeCenter PS Blade Overview Enhances most popular blades for UNIX* with 3 New Offerings! IBM BladeCenter PS700 Express IBM BladeCenter PS701 Express IBM BladeCenter PS702 Express POWER7 4-Core (1 Socket x 4 Cores per blade) Single Wide POWER7 8-core (1 Socket x 8 Cores per blade) Single Wide POWER7 16-core (1 Socket x 8 Cores per blade) Double Wide 4GB to 64GB DDR3 (Chipkill) 4GB@1066MHz, 8GB@800MHz 4GB to 128GB DDR3 (Chipkill) 4GB@1066MHz, 8GB@800MHz 4GB to 256GB DDR3 (Chipkill) 4GB@1066MHz, 8GB@800MHz 0-2 SAS disk 0-1 SAS disk 0-2 SAS disk 1 PCI-E CIOv Expansion Card 1 PCI-E CFFh ExpansionCard 1 PCI-E CIOv Expansion Card 1 PCI-E CFFh ExpansionCard 2 PCI-E CIOv Expansion Card 2 PCI-E CFFh ExpansionCard Integrated Features Keyboard, Video and Mouse Dual Port 1Gb Ethernet SAS Controller USB Keyboard, Video and Mouse Dual Port 1Gb Ethernet SAS Controller USB Keyboard, Video and Mouse Quad Port 1Gb Ethernet SAS Controller USB Scalability Support Architecture Memory DASD / Bays Expansion Card Slots No Yes – Factory or Customer Upgrade Yes – Factory or Customer Upgrade Fibre Support Yes (via BladeCenter Chassis) Yes (via BladeCenter Chassis) Yes (via BladeCenter Chassis) Redundant Power Yes (via BladeCenter Chassis) Yes (via BladeCenter Chassis) Yes (via BladeCenter Chassis) Redundant Cooling Yes (via BladeCenter Chassis) Yes (via BladeCenter Chassis) Yes (via BladeCenter Chassis) Service Processor FSP1 (IPMI, SOL) FSP1 (IPMI, SOL) FSP1 (IPMI, SOL) IBM PowerVM (optional Editions) IBM PowerVM (optional Editions) IBM PowerVM (optional Editions) IBM Director and CSM IBM EnergyScale Technology IBM Director and CSM IBM EnergyScale Technology IBM Director and CSM IBM EnergyScale Technology AIX, i, Linux AIX, i, Linux AIX, i, Linux BCE, BCH*, BCHT, BCT, BCS* BCH*, BCHT, BCS* BCH*, BCHT, BCS* * In Power Systems Channel * In Power Systems Channel * In Power Systems Channel Virtualization Systems Management OS Support BladeCenter Chassis Support * IDC 4Q2009 Server Tracker RISC/Itanium blades Performance & Virtualization versus the competition Power Systems Virtualization for Oracle – Tier Consolidation & Virtualization – Dynamically Resizable 8 Cores 11Core Cores Virtual I/O CUoD Server Partition Int Virt Linux Manager AIX V5.3 Linux Oracle10g Oracle11g Oracle 11g Tier Consolidation AIX V5.3 Oracle 9i Storage Sharing Ethernet Sharing 3 24 3 Cores CoresCores PowerVM‟s Linux WebSphere WebSphere WebSphere WebSphere WebSphere Manager 6 Cores Oracle9i Oracle 10g Oracle 10g Int Virt Linux 8 Cores Oracle 10g Server Partition 16 Cores PowerVM‟s Oracle 11g 1 Core Cores Virtual I/O Storage Sharing Ethernet Sharing Virtual LAN POWER Hypervisor ISV Pricing on Power 64 core system Network Oracle EE: 38 cores WebSphere: 1920 PVUs Do not pay for VIO server or CUoD cores Virtual Network WebSphere to Oracle works at memory speeds Network Live Partition Mobility On Oracle Workloads Reduce impact of planned outages, relocate workloads to enable growth, provision new technology with no disruption to service LPAR-1 LPAR-2 LPAR-3 LPAR-4 VIOS VIOS Migration Controller Migration Controller LPAR-1 LPAR-2 LPAR-3 LPAR-4 Oracle Oracle Def 1 P P P P Def 2 Def 3 P P P P P P P P P P P Def 4 AIX Kernel AIX Kernel AIX Kernel AIX Kernel Hypervisor P P P PP PP P P P PP PP PP P P P AIX Kernel AIX Kernel AIX Kernel AIX Kerne Hypervisor Ethernet Partition Mobility Requires: • POWER6 • AIX 5.3 / 6.1 or Linux • All resources must be “Virtualized” •No real resources • SAN storage environment •SAN Boot, temp space, same network SAN Boot Data Partition Mobility Steps Validation Copy memory pages Host to target systems Transfer Turn off Host resources Activate Target resources The number of Oracle licenses needed does not change before and after the migration Customer Shared Pool More SAP performance than any 8-socket system in the industry Comparable to a 128-core, 32-socket Sun M9000 15,600 SAP users on SAP SD 2 Tier Power 750 Express with DB2 8-core Sun Fire X4270 Xeon 5500 2-sockets 24-core 32-core 32-core HP DL585 Sun T5440 Power 750 AMD 4-sockets 48-core 48-core 128-core HP DL785 Sun x4640 Sun M9000 AMD AMD 8-sockets BSee SAP Benchmarks chart for detail or SAP website est SAP 2-Tier Results for 2, 4 , 8 and 16 sockets. 32-sockets The most energy efficient 4-socket system on the planet The first Energy Star certified RISC system Power 750 Most energy efficient systems Performance Per Watt Itanium HP rx6600 11 5 SPARC Sun T5440 x86 HP DL585 POWER7 Power 750 with PowerVM Power 750 Delivers Superior Performance than HP Integrity Entry, Midrange and High End Servers • More than 10X performance than 4-socket HP Integrity rx6600 server • 28% better performance than 64-core HP Integrity Superdome IBM Power 750 Express Performance 32 cores 64 cores 32 cores 8 cores Power 750 HP rx6600 16 cores HP rx7640 HP rx8640 HP Superdome See Power 750 Performance and Efficiency compared to HP Integrity servers for substantiation detail. Source: SPECiint_rate2006. For the latest SPEC benchmark results POWER7 means more SAP Throughput SD 2-Tier ERP tests* show on Power 750 show new levels of throughput – Over 7X better per processor throughput than Sun SPARC M9000 – Over 3X better per processor throughput than Sun SPARC T5440 – Over 3X better per processor throughput than HP ProLiant DL585 G6 IBM Power 750 Express – Over 2X better per processor throughput than Sun X4270 Users per processor/socket 4000 3500 3000 2500 2000 1500 1000 500 0 Pow er 750 SUN M9000 SUN x4270 HP DL585 G6 SUN T5440 Benchmark 3900 3900 Power 750 272 SUN M9000 1180 SUN T5440 1900 SUN x4270 1166 HP DL585 G6 S1 Consolidate HP Integrity rx7640 and 71 Proliant DL380 G5 Linux Servers onto One Power 750 server Utilize 3% of the previous energy 97% less space – 3+ racks to one Power 750 552 fewer cores reducing per core s/w licensing Dramatically reduce network and power cabling complexity HP Integrity rx7640 • 1.6GHz; 10U • 2,128W • SPECint_rate2006: 201 IBM Power 750 Express 71 X HP Proliant DL380 G5 • 3.0Ghz; 2U X 62 servers • 1,193W; Total = 110,949W • SPECint_rate2006: 36.2 3.55 GHz; 4U 1,950W SPECint_rate2006: 1060 IBM Power 780 Delivers Performance with Efficiency 780 delivers over 3X the performance per core of HP Superdome and Sun M9000 Performance Per Core Performance Per Watt 780 delivers over 5.8X the performance per watt of HP Superdome and Sun M9000 HP Superdome Sun M9000 POWER6 POWER7 HP Superdome Sun M9000 POWER6 POWER7 System Chip/Core/Thread Date SPECint_rate2006 Per core Maximum energy requirement (WATTs) Per KWatt IBM Power 780 (3.8 GHz POWER7) 8/64/256 February 2010 2530 39.5 6,400 395 IBM Power 570 (4.2 GHz POWER6) 16/32/64 October 2008 832 26 5,600 148 Sun SPARC Enterprise M9000 64/256/512 October 2009 2586 10.1 44,800 58 HP Integrity Superdome (1.6 GHz Itanium 2) 64/128/128 September 2006 1648 12.875 24,392 68 Source: http://www.spec.org IBM results available at announcement. All other results as of 01/27/10. Not all results listed. Performance per KWatt is ca lculated by dividing the performance by the recommended maximum power usage for site planning. This defines the requirement for the power infrastructure. Actual power used by the systems will be less t han this value for all of the systems. For HP systems, this information is contained in the QuickSpecs available through www.hp.com. For Sun systems, this information is available through the respective Site Planning Guides available through www.sun.com. 119 Power 750 Express delivers Best of Breed eBS R12 Order To Cash performance Delivers the best eBS R12 Order to Cash Medium 2-tier result. Surpasses 55XX per system, per processor and per core results 64% higher per core and 23% overall against Nehalem 55XX 8-core system. Template Documentation IBM Power 750 Express Power 750 Express delivers Best of Breed eBS R12 Payroll performance Delivers the best eBS R12 Payroll Medium 2-tier result - Surpasses HP per system, per processor and per core IBM Power 750 Express 6 core Power 750 out performs HP’s 8 core DL380 G6 - 49% higher per core and 12% overall Oracle eBS R12 Payroll Batch 257,143 250,000 checks per hour 200,000 257,143 229,885 IBM 750 6-core HP DL380-G6 8-core 198,020 HP DL380-G5 8-core 150,000 114,943 100,000 78,534 42,857 50,000 28,736 0 System Performance per processor Template Documentation per core 19,634 POWER Runs Virtualized Every Time, All the Time • All Power systems run virtualized all the time • VMWare overhead is up to 20% running OLTP applications VMWare overhead 5 4 3 2 1 0 2 virtual cpu's 4 virtual cpu's ESX 8 virtual cpu's Native Source: Virtualizing Performance-Critical Database Applications in VMware® vSphere™ a vailable at http://www.vmware.com/pdf/Perf_ESX40_Oracle-TPC-Ceval.pdf as of August 21, 2009 Relative virtualized performance per core Database SAP 2-tier SD Power 780 TurboCore Integer Power 750 Xeon 5500 Fltg Pt Xeon 7400 Run in a virtualized environment & the POWER advantage grows! OverPOWERing Nehalem More scalability Up to 64 lightning fast cores Avoid scaleout overhead More performance per socket Up to eight lightning fast cores More performance per core Lightning fast cores More systems infrastructure – especially in TurboCore mode Up to 3.5 X the memory per core Up to 7 X the memory bandwidth per core Up to 3.5 X the L2 + L3 cache per core Less virtualization overhead TPC-C POWER7 vs. Competition (per core results) 160000 140000 120000 POWER7 Nehalem-EX Nehalem-EP Itanium/2 Opteron SPARC(Niagara) 100000 80000 60000 40000 20000 0 TPC-C/Core www.tpc.org Active Memory Expansion Act Mem Exp – Turning a Partition On or Off With HMC, check Active Memory Expansion box and enter true and max memory memory expansion factor To turn off expansion, unclick box Partition IPL required to turn on or off Active Memory Expansion Modeled Statistics: ----------------------Modeled Expanded Memory Size : 8.00 GB Expansion Factor --------1.21 1.31 1.41 1.51 1.61 True Memory Modeled Size -------------6.75 GB 6.25 GB 5.75 GB 5.50 GB 5.00 GB Modeled Memory Gain ----------------1.25 GB [ 19%] 1.75 GB [ 28%] 2.25 GB [ 39%] 2.50 GB [ 45%] 3.00 GB [ 60%] CPU Usage Estimate ----------0.00 0.20 0.35 0.58 1.46 Active Memory Expansion Recommendation: --------------------The recommended AME configuration for this workload is to configure the LPAR with a memory size of 5.50 GB and to configure a memory expansion factor of 1.51. This will result in a memory expansion of 45% from the LPAR's current memory size. With this configuration, the estimated CPU usage due to Active Memory Expansion is approximately 0.58 physical processors, and the estimated overall peak CPU resource required for the LPAR is 3.72 physical processors. 127 5.5 true 8.0 max Sample SAP ERP Workload Test Results Details at Constant Throughput: Single Partition (DB + AppServer) True GB 0% 12% 46% 73% 14.25 12.70 11.25 9.75 Gained GB 0 Total GB 27% 1.55 3.0 4.50 10 5 , 0 0 111% 171% 8.25 6.75 5.25 6.0 7.50 9.0 14.25 14.25 14.25 14.25 14.25 14.25 14.25 Test configs held total memory constant at 14.25 GB, varying mix of real and gained memory. Number cores constant at 4 cores. Throughput (% Nominal) % Expand Throughput 10 0 , 0 0 95,00 90,00 85,00 No Impact on throughput at 111% memory expansion 80,00 75,00 0% 12 % 27% 46% 73% 111% 17 1% Mem ory Expansion (%) CPU Utilization Response Time 111% more memory for 15% additional CPU 100 CPU Utilization (%) 93 80 75% more memory for 1% additional CPU 60 60 61 61 61 75 61 0 ,8 0 ,6 Minimal impact to response time at 111% expansion 0 ,4 0 ,2 0 ,0 40 0% 12 % 27% 46% 73% 111% 17 1% Mem ory Expansion (%) 20 12 8 Response Time (s) 1,0 Your results will vary depending on compressibility of the data and available CPU resource 0 0% 12% 27% 46% 73% Memory Expansion (%) 111% 171% Sample SAP ERP Workload, Single Partition With Active Memory Expansion Without Active Memory Expansion + AppServer) (DataBase Partition utilization Partition utilization Memory: 100% (18 GB true) CPU: 88% (12 cores in LPAR) Note: Most of Memory: 100% (18 GB) CPU: 46% (12 cores in LPAR) the CPU increase is due to additional work done on server Memory capacity is the bottle-neck CPU is under-utilized Handles 1000 simulated users Higher throughput enabled with the same amount of physical memory Gain 37% memory capacity Handles 1700 simulated users Max Partition throughput: 99 tps 12-core POWER7 partition 18 GB Memory 18 GB true . 0 GB expanded + 65% Max Partition Throughput: 166 tps 12-core POWER7 partition 24.7 GB Memory 18 GB true . 6.7 GB expanded Expanded Memory Note: This is an illustrative scenario based on using a sample workload. This data represents measured results in a controlled lab environment. Your results may vary. Active Memory Expansion – Client Deployment Steps Planning Tool 60-Day Trial Deploy into Production A. Part of AIX 6.1 TL4 B. Calculates data compressibility & estimates CPU overhead due to Active Memory Expansion C. Provides initial recommendations A. One-time, temporarily enablement B. Config LPAR based on planning tool C. Use AIX tools to monitor Act Mem Exp environment D. Tune based on actual results A. Permanently enable Active Memory Expansion B. Deploy workload into production C. Continue to monitor workload using AIX performance tools Memory Expansion 130 Actual Results App. Performance Estimated Results Memory Expansion Performance 3 CPU Utilization 2 CPU Utilization 1 Time Memory Expansion POWER7 Related Announcements POWER7 Virtualization Support •Maintain 1 to 10 ratio for Physical cores to LPARs Power 750 Power 755 Power 770 / 78: Up to 160 (320) LPARS Not Supported Up to 160 (640) LPARs •Active Memory Expansion Active Memory Expansion compresses in-memory data to fit more data into memory • Increases the effective amount of memory capacity for AIX partitions Managed by the OS and hypervisor • OS compresses and decompress data based on memory accesses Is transparent to applications 134 AIX 6 Editions • AIX 6 is available in three different editions: – AIX 6 Standard Edition • Suitable for most UNIX workloads • Vertical scalability up to 64 cores AIX Enterprise Edition – AIX 6 Enterprise Edition • AIX plus enterprise management • Includes AIX 6 Standard Edition plus Systems Director Enterprise Edition and the Workload Partitions Manager for AIX • Vertical scalability up to 64 cores AIX Standard Edition AIX Express Edition – AIX 6 Express Edition • Lower priced edition targeted a low end servers and consolidation of smaller workloads on larger servers • Includes all the functionality of AIX 6 Standard Edition • Vertical scalability is limited to 4 cores and 8GB of memory per core in a single partition • Clients can use multiple AIX Express Edition partitions in a single larger server • Clients can mix multiple AIX editions in the same server AIX Enterprise Edition AIX Enterprise Edition is a single offering that brings together AIX 6 with key service management capabilities that are designed to: Improve availability through access to relevant real-time information and predictive monitoring to avoid future problems Enhance operational efficiency through visualization of resources and centralized deployment and management of virtualized AIX environments Provide accurate assessment of system resource usage AIX Enterprise Edition includes: – AIX 6 – WPAR Manager V2.1 – Systems Director Enterprise Edition • • IBM System Director 6.1.2 Active Energy Manager 4.2 • • • • • • VMControl 2.2 (including Image Management & System Pools) Network Control 1.1 Transition Manager for HP® SIM Service and Support Manager 6.1.2 IBM Tivoli Monitoring 6.2.2 Agents: ITM for Energy Mgmt v6.2; VMControl Agent v2.2; Power System Agents (CEC, AIX Premium, VIOS, HMC) v6.2.1; Systems Director Agent TADDM v7.2 • AIX Enterprise Edition Helps you Monitor and Repair Power Server Systems Monitor resources to maintain system availability Platform and enterprise system monitoring Proactive alerts System pool monitoring Analyze system status to find the root cause of problems more quickly At-a-glance status of critical systems Root cause analysis Enhanced correlation Repair or prevent system faults to reduce service downtime Automated response and updates Workload migration Proactive notification VMControl Editions: Added Value for PowerVM Clients VMControl Express Edition VMControl Standard Edition VMControl Enterprise Edition Manage resources Automate virtual images Optimize system pools Create/manage virtual machines (x86, PowerVM and z/VM) Virtual machine relocation Capture/import, create/remove standardized virtual images Deploy standard virtual images Maintain virtual images in a centralized library VMControl Virtualization Capabilities PowerVM Create/remove system pools and manage resources in system pools Add/remove physical servers within system pools More Easily Migrate Linux x86 Applications to Power Run x86 Linux applications on Power alongside your AIX, i and Linux on Power applications Simplifies migration of Linux x86 applications enabling customers to realize the energy and administration savings of consolidation Run most existing 32-bit x86 Linux applications with no application changes Included with the purchase of PowerVM Editions POWER6 blades through Power 595; POWER7 servers – outlook 2Q2010 developerWorks download: http://www.ibm.com/developerworks/linux/pave/ PowerVM™ Lx86 PowerVM x86 x86 Linux x86 Linux App Linux App App Linux Linux Linux x86 Platforms x86 Platforms x86 Platforms Install and Run No Porting No Recompile No changes x86 Linux App PowerVM Lx86 POWER Linux Application Linux AIX Application i Application AIX IBM i Power Systems Platform 140 2009 – 2011 AIX TL Roadmap 10/2009 04/2010 AIX 5.3 10/2010 04/2011 10/2011 POWER7 Hardware Support TL8 TL9 TL10 TL11 TL11 SP SP SP TL12 AIX 6.1 TL1 TL2 TL3 TL4 TL4 SP SP SP TL5 TL6 TL7 TL8 TL0 SP Service Pack POWER7 Support AIX 7.1 TL1 TL2 Source for full survey on : http://iticcorp.com/blog/2009/07/itic-2009global-server-hardware-server-osreliability-survey-results/ 145 IBM i Roadmap 2008 2009 IBM i 6.1 2010 2011 2012 IBM i Strategy of a major new release of IBM i every two years Next IBM i IBM i 6.1.1 IBMSOD i 7.1 „06 V5R2 „07 „08 „09 „10 „11 „12 „13 „14 „15 „16 IBM i Upgrade paths V5R3 5.4* 6.1* 7.1* Service *The projected date for the service of IBM i releases is based on current IBM planning assumptions. Note that it is IBM‟s current practice to support an IBM i release until the next two releases have been made available, plus twenty four months. This slide contains information about IBM‟s plans and directions. Such plans are subject to change without notice. Partition Mobility POWER6 POWER6+ POWER7 Binary Compatibility between POWER6 and POWER7 Leverage POWER6 / POWER6+ Compatibility Mode Migrate partitions between POWER6 and POWER7 Servers Forward and Backward New DAT320 Tape Drive Up to 100% more Up to 70% faster Up to 50% less DAT160 baseline DAT320 Capacity DAT320 Speed DAT320 Energy Only 30% more DAT320 Price • Placed in POWER7 750 (or POWER6 520/550) CEC HH bay –Available 19 Feb for Power 750, and 16 March for Power 520/550 • Reads/writes DAT160, but does not read/write DAT72 • Requires AIX 5.3, IBM i 6.1, SUSE 10, Red Hat 4.8 (or later) POWER7 Upgrades POWER7 System Upgrades – You Can Get there. Upgrades from POWER6 and POWER6+ All existing Power 570 systems can upgrade to POWER7 POWER6+ 570/32 4.2 GHz Power 780 3.8 GHz / 4.1 GHz POWER6+ 570 9179-MHB 4.4, 5.0 GHz POWER6 570 Power 770 3.5 GHz 3.5, 4,2, 4.7 GHz 9117-MMA 9117-MMB POWER6 upgrades to POWER7 POWER6+ upgrades to POWER7 Power 570/32 upgrades to POWER7 I/O Upgrade Considerations • All the newer IBM I/O drawers (12X), disk, SSD and PCI adapters used on POWER6 supported on POWER7 servers – May need to move 3.5-inch SAS drives and PCI-X adapters • Older I/O on POWER6 servers, but not on POWER7 servers – RIO/HSL I/O drawers – SCSI disk smaller than 69GB or SCSI drives slower than 15k rpm – QIC tape drives – IOPs and IOP-based PCI adapters (IBM i) 2749, 5702, 5712, 2757, 5581, 5591, 2790, 5580, 5590, 5704, 5761, 2787, 5760, 4801, 4805, 3709, 4746, 4812, 4813 – Older LAN adapters: #5707, 1984, 5718, 1981, 5719, 1982 – Older SCSI adapters: #5776, 5583, 5777 – Telephony adapter: #6412 –See planning web page www.ibm.com/systems/power/hardware/sod2.html Power SODs for Upgrades Definition “upgrade” as a model change keeping same serial number • Power 595 – SOD issued in 2009 & augmented 2010 • Power 570 – SOD issued in 2009 – Upgrades announced Feb 2010, shipping June 2010 – Built on unified structure, 9406-MMA must first convert to 9117-MMA • Power 575 and 560 and 550 – SODs not issued • Power 520 – SOD issued February 2010 with plans to be delivered in 2010 – For Power 520 (8203-E4A) 2-core or 4-core servers – Insight: POWER5 520 to POWER6 520 upgrades did not have savings in the hardware. Client savings were in easy license transfer (including IBM i), documented upgrade procedures for upgrading, and perhaps easier leasing/depreciation structure continuation POWER7 High-End Statement of Direction • IBM plans to deliver a new high-end server in 2010 with up to 256 POWER7 processor cores • Designed to operate within the same physical footprint and energy envelope of the current 64core Power 595 server. • High-Voltage DC Power option • IBM also plans to provide an upgrade path from the current IBM Power 595 server with 12X I/O to the new POWER7 high-end server. • Enterprises with multiple systems leveraging PowerVM Live Partition Mobility may use this function to maintain application availability during the upgrade process. Power Solid State Drives (SSD) Update • Feb 2010 –SSD support in Power 750, 755, 770, 780 system units • Dec 2009 HUGE price action –48% price reduction (plus 30% maintenance reduction) –Aligned SSD with memory price reduction –Some countries deferred price action to 2010 • Oct/Nov 2009 –“Enterprise class vs. consumer SSD” white paper –IBM i analysis tool –SSD configuration & performance enhancements –AIX analysis paper by Dan Braden –#1 SCP-1 benchmark - 595 + 84 SSD 48%