High-Frequency Electronics Design (ME715) Instructor Information
Transcripción
High-Frequency Electronics Design (ME715) Instructor Information
Instituto Tecnológico y de Estudios Superiores de Occidente Departamento de Electrónica, Sistemas e Informática Maestría en Diseño Electrónico High-Frequency Electronics Design (ME715) Jan-May 2009 19-22 hrs, Tuesdays Classroom W-107 Instructor Information José Ernesto Rayas Sánchez, Ph.D. Office: T-333 Office hours: 10-14, 17:00-21:00 hrs Tel: 3669-3598, Ext. 3096 Email: [email protected] Website: http://iteso.mx/~erayas General Description This course will enable students for the analysis and design of high-frequency electronic circuits. Students will identify the current relevance of RF and microwave techniques in modern electronics circuit design. They will be able to describe some of the basic signal integrity concepts that characterize high-speed links. Students will analyze high-frequency circuits using fundamental transmission line theory, in both frequency and transient domains. They will design fundamental RF circuits such as impedance matching networks, filters, and amplifiers. They will also learn how to design physical interconnect networks implemented in typical planar technologies (microstrips, striplines, etc.). Students will be able to describe the main performance parameters of an antenna, as well as to simulate their most fundamental characteristics. High frequency distributed-circuit simulation tools and electromagnetics-based simulation software will also be employed though out the course. Prerequisites No previous graduate course is required. However, it is expected that students taking this course have a good understanding of basic electronics and circuit analysis. Experience with SPICE simulation would be very useful. The students should already have some familiarity with Matlab or any other similar numerical analysis tool. Learning Objectives By the end of the course the student will be able to: A. Identify the technological and economical relevance of the RF and wireless systems (COMPREHENSION). B. Describe the main high-frequency effects on typical transmission media (APPLICATION). C. Identify some of the main signal integrity concepts related to high-speed interconnects 1 Periférico Sur 8585 45604 Tlaquepaque, Jal., México Tel +52 33 3669 3598 / Fax 3669 3511 www.iteso.mx Instituto Tecnológico y de Estudios Superiores de Occidente Departamento de Electrónica, Sistemas e Informática Maestría en Diseño Electrónico (COMPREHENSION). D. Calculate characteristic impedances, reflection coefficients, standing wave ratios, insertions losses, etc., using fundamental transmission line theory (ANALYSIS). E. Efficiently use the Smith Chart for basic and advanced transmission line calculations (APPLICATION). F. Analyze linear circuits in the frequency domain using scattering parameters and ABCD parameters (ANALYSIS). G. Analyze linear and nonlinear transmission line problems in the transient domain using lattice and Bergeron diagrams (ANALYSIS). H. Model basic passive components (lumped elements) for high-frequency applications (SYNTHESIS). I. Design planar interconnects for high-frequency applications in microstrip and stripline technologies (SYNTHESIS). J. Design impedance matching networks using quarter-wave transformers, stub tuning and other similar techniques (SYNTHESIS). K. Efficiently use commercially available CAD tools for simulating high-frequency circuits, including distributed circuit simulators and full-wave electromagnetic simulators (APPLICATION). L. Design basic high-frequency amplifiers and filters (SYNTHESIS). M. Explain the main performance parameters of an antenna (COMPREHENSION). N. Simulate the fundamental characteristics of a basic printed antenna using full-wave field solvers (APPLICATION). Contents 1. An introduction to high-frequency circuits and signal integrity 2. High-frequency effects on transmission media 2.1. Common transmission media 2.2. Modeling uniform interconnects 2.3. Interconnect parasitics and their physical significance 2.4. EM-effects: Skin effect, proximity effect, edge and Indy effects 2.5. From lumped circuits to distributed circuits 3. Fundamental transmission line theory 3.1. Telegrapher equations and wave equation 3.2. Traveling waves 3.3. Characteristic impedance 3.4. Reflection coefficient along the line 3.5. Input impedance along the line 3.6. Lossless transmission lines 3.7. Power along the line 3.8. Return loss 3.9. Standing wave ratio 2 Periférico Sur 8585 45604 Tlaquepaque, Jal., México Tel +52 33 3669 3598 / Fax 3669 3511 www.iteso.mx Instituto Tecnológico y de Estudios Superiores de Occidente Departamento de Electrónica, Sistemas e Informática Maestría en Diseño Electrónico 4. 5. 6. 7. 8. 3.10. Transmission coefficient 3.11. Insertion Loss 3.12. Input impedance in lossless transmission lines (TL) 3.13. Lossy vs Lossless Transmission Lines 3.14. The low-loss line 3.15. The lossy distortionless line 3.16. How to decide if transmission line theory is needed in practical interconnects The Smith Chart 4.1. Smith Chart origin and interpretation 4.2. Mathematical foundation of the Smith Chart 4.3. Basic Smith Chart applications 4.4. Open circuit transformations 4.5. Short circuit transformations 4.6. Impedance-admittance transformations 4.7. The quarter-wave transformer Frequency-domain analysis of transmission line circuits 5.1. Impedance and admittance parameters 5.2. Scattering parameters 5.3. The transmission (ABCD) matrix 5.4. Analyzing interconnects with discontinuities 5.5. Differential mode signaling 5.6. Mode conversion 5.7. Even and odd impedance 5.8. Differential S-parameters 5.9. Termination techniques for differential signaling 5.10. Two-Coupled Microstrip Lines Transient-domain analysis of transmission line circuits 6.1. Quarter-wave transformer – transient response 6.2. Reflection coefficient revised 6.3. Concept of “transient impedance” 6.4. Applying DC to transmission lines 6.5. Lattice (or bouncing or reflection) diagrams 6.6. Building transient signals from bouncing diagrams 6.7. Under-driven and over-driven lines 6.8. Bouncing diagrams for multiple sections of transmission lines 6.9. Bergeron diagrams 6.10. Bergeron diagrams for fully nonlinear terminations CAD tools for high-frequency simulation 7.1. SPICE-like simulation 7.2. Tools for distributed-circuit simulation 7.3. Tools for full-wave EM simulation Fundamental passive components at high frequencies 8.1. Lumped resistors 8.2. Lumped capacitors 8.3. Lumped inductors 3 Periférico Sur 8585 45604 Tlaquepaque, Jal., México Tel +52 33 3669 3598 / Fax 3669 3511 www.iteso.mx Instituto Tecnológico y de Estudios Superiores de Occidente Departamento de Electrónica, Sistemas e Informática Maestría en Diseño Electrónico 9. Analysis and design of basic interconnects 9.1. Strip lines 9.2. Microstrip lines 9.3. Coupled microstrip lines 9.4. Even and odd modes in coupled lines 9.5. Crosstalk 10. Impedance matching circuits 10.1. Benefits of impedance matching 10.2. Matching with L-sections 10.3. Driving capacitive loads 10.4. Single-stub tuning 10.5. Double-stub tuning 10.6. Impedance transformers 11. High-frequency filters 11.1. The insertion loss method to filter design 11.2. Filter scaling and transformations 11.3. Physical design of high-frequency filters in microstrip technology 12. High-frequency amplifiers 12.1. Transistor models 12.2. Data-sheets for high-frequency transistors 12.3. Stability 12.4. Input-output matching 12.5. Power gain 12.6. Bias circuits 13. An introduction to antennas 13.1. Antenna system parameters 13.2. Basic practical antennas 13.3. Antenna patterns 13.4. Efficiency, gain and temperature of an antenna 13.5. The Friis equation 13.6. Electromagnetic simulation of antennas Relationship between Contents and Objectives 1 2 3 4 5 6 7 8 A B C D E F G H I √ √ √ √ √ √ √ √ √ √ J K L M N √ √ 4 Periférico Sur 8585 45604 Tlaquepaque, Jal., México Tel +52 33 3669 3598 / Fax 3669 3511 www.iteso.mx Instituto Tecnológico y de Estudios Superiores de Occidente Departamento de Electrónica, Sistemas e Informática Maestría en Diseño Electrónico √ 9 10 11 12 13 √ √ √ √ √ √ √ Course Skeleton Below it is shown the basic course skeleton. For the proposed course skeleton it is assumed: a group of 5 to 20 students; 3 hours per week of class meetings during approximately 15 weeks; simulation software available at ITESO and/or at home (for SPICE simulation: WinSpice, OrCad PSpice, Electronic Workbench or any other similar circuit simulator; for EM simulation: Sonnet and CST Microwave Studio; for high-frequency circuit simulation: Aplac; for general computing: Matlab). It is also expected that the student will be able to dedicate an average of 8 hours of work per week to this course, including attending classes. Week Activity 1 2 3 4 Assignment 1 5 6 7 Assignment 2 8 Week 9 10 11 12 13 14 15 16 Activity Assignment 3 Assignment 4 Final project Assessment The overall grade in this course will be built from the following elements: Assignments Project Participation 65% 30% 5% Assignments will be posted through out the course in the instructor website. Students will realize a final application project during the course. The topic chosen must be approved by the instructor. The final project must be submitted following a template that will be indicated later in the course. Students will make a technical presentation on their final project selected. Depending on the selected topic and class size, the project and the corresponding presentation can be realized individually or in teams of up to 3 students. The report must be hand in on the day of the presentation. The presentation will be evaluated not only by the instructor but also by the classmates. Further instructions about the technical presentations will be delivered later. 5 Periférico Sur 8585 45604 Tlaquepaque, Jal., México Tel +52 33 3669 3598 / Fax 3669 3511 www.iteso.mx Instituto Tecnológico y de Estudios Superiores de Occidente Departamento de Electrónica, Sistemas e Informática Maestría en Diseño Electrónico The quality of the participation of the students during the lectures will be graded. This participation will be evaluated based on student’s attitude and performance during class: punctuality, willingness to ask relevant questions, respect to others, attention during class, ability to answer questions, etc. Teaching Methods This course will use a variety of teaching methods including: lecturing, seminars, computer simulations, assignments, readings, project report writing and self-conducted research work. Important information related to the course will be posted in the instructor’s web site throughout the semester. Open and frequent communication with the instructor is encouraged. Collaboration between the students is also encouraged. The course will be conducted mainly in Spanish. Most of the written material for the course will be available in English. Bibliographic References Microwave Engineering David M. Pozar Wiley, 1998 RF Circuit Design: Theory nand Applications Reinhold Ludwig and Pavel Bretchko Prentice Hall, 2000 Microwave and RF Design of Wireless Systems David M. Pozar Wiley, 2000 Small Signal Microwave Amplifier Design Theodore Grosh Noble Publishing, 1999 Electromagnetics for High-Speed Analog and Digital Communication Circuits Ali M. Niknejad Cambridge University Press, 2007 High-Speed Digital System Design Stephen H. Hall, Garret W. Hall and James A. McCall Wiley-Interscience, 2000 High-Speed Circuit Board Signal Integrity Stephen C. Thierauf Artech House, 2004 6 Periférico Sur 8585 45604 Tlaquepaque, Jal., México Tel +52 33 3669 3598 / Fax 3669 3511 www.iteso.mx Instituto Tecnológico y de Estudios Superiores de Occidente Departamento de Electrónica, Sistemas e Informática Maestría en Diseño Electrónico Microstrip Lines and Slotlines K.C. Gupta, Ramesh Garg, Inder Bahl, Prakash Bhartia Artech House, 1996 Computer-Aided Design of Microwave Circuits K. C. Gupta, R. Garg, and R. Chadha Artech, 1981 Microwave Circuit Modeling Using Electromagnetic Field Simulation Daniel G. Swanson and Wolfgang J. R. Hoefer Artech Publishers, 2003 Other Resources Instructor’s website: http://iteso.mx/~erayas/hf_design.htm CAECAS Research Group http://www.desi.iteso.mx/caecas/ First IEEE MTT-S International Microwave Workshop Series in Region 9, on Signal Integrity and High-Speed Interconnects www.imws2009-r9.org Agilent Educator’s Corner http://www.educatorscorner.com/ MIT Open Courseware http://ocw.mit.edu/index.html Intel Higher Education Program http://www.intel.com/education/highered/ Hyper-Physics - Georgia State University http://hyperphysics.phy-astr.gsu.edu/hbase/hframe.html Software Tools APLAC, EM and high-frequency circuit simulator http://www.aplac.hut.fi/aplac/main.html Sonnet, EM simulator www.sonnetusa.com 7 Periférico Sur 8585 45604 Tlaquepaque, Jal., México Tel +52 33 3669 3598 / Fax 3669 3511 www.iteso.mx Instituto Tecnológico y de Estudios Superiores de Occidente Departamento de Electrónica, Sistemas e Informática Maestría en Diseño Electrónico CST Microwave Studio http://www.sonnetsoftware.com/products/cst/index.asp WinSpice circuit simulator http://www.winspice.com/ Cadence (Pspice Orcad) http://www.cadencepcb.com/products/pspice/ ____________ NOTA: En caso de alguna dificultad o confusión respecto de este programa de estudios (por estar en idioma inglés), favor de consultar directamente con el profesor. 8 Periférico Sur 8585 45604 Tlaquepaque, Jal., México Tel +52 33 3669 3598 / Fax 3669 3511 www.iteso.mx